Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2005-11-22 |