Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2005-11-22 |
| 6891233 | Methods to form dual metal gates by incorporating metals and their conductive oxides | Wenhe Lin, Mei Sheng Zhou, Kin Leong Pey | 2005-05-10 |
| 6846899 | Poly(arylene ether) dielectrics | Christopher Lim, Siu Choon Ng, Hardy Chan, Mei Sheng Zhou | 2005-01-25 |