Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2005-11-22 |
| 6872633 | Deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to ≦0.10 microns | Liu Huang | 2005-03-29 |