| 6967153 |
Bump fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2005-11-22 |
| 6927964 |
Structure for preventing burnt fuse pad from further electrical connection |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2005-08-09 |
| 6891274 |
Under-bump-metallurgy layer for improving adhesion |
William T. Chen, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more |
2005-05-10 |
| 6891360 |
Plated probe structure |
Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Eugene J. O'Sullivan, Da-Yuan Shih |
2005-05-10 |
| 6877653 |
Method of modifying tin to lead ratio in tin-lead bump |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2005-04-12 |
| 6875683 |
Method of forming bump |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more |
2005-04-05 |
| 6864168 |
Bump and fabricating process thereof |
William T. Chen, Chun-Chi Lee, Su Tao, Chih-Huang Chang, Jeng-Da Wu +2 more |
2005-03-08 |
| 6861346 |
Solder ball fabricating process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2005-03-01 |
| 6846719 |
Process for fabricating wafer bumps |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2005-01-25 |
