Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967153 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more | 2005-11-22 |
| 6939790 | Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder | Su Tao | 2005-09-06 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more | 2005-08-09 |
| 6908842 | Bumping process | Su Tao | 2005-06-21 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more | 2005-04-12 |
| 6875683 | Method of forming bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +2 more | 2005-04-05 |
| 6861346 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +3 more | 2005-03-01 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more | 2005-01-25 |