Issued Patents 2005
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967153 | Bump fabrication process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-11-22 |
| 6946729 | Wafer level package structure with a heat slug | Su Tao | 2005-09-20 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-08-09 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | William T. Chen, Ho-Ming Tong, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more | 2005-05-10 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-04-12 |
| 6875683 | Method of forming bump | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2005-04-05 |
| 6864168 | Bump and fabricating process thereof | William T. Chen, Ho-Ming Tong, Su Tao, Chih-Huang Chang, Jeng-Da Wu +2 more | 2005-03-08 |
| 6863208 | Wire bonding process and wire bond structure | — | 2005-03-08 |
| 6861346 | Solder ball fabricating process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2005-03-01 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-01-25 |