Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972489 | Flip chip package with thermometer | Ching-Hsu Yang | 2005-12-06 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Chih-Huang Chang +1 more | 2005-05-10 |
| 6864168 | Bump and fabricating process thereof | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Chih-Huang Chang +2 more | 2005-03-08 |