Issued Patents 2005
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967153 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-11-22 |
| 6946729 | Wafer level package structure with a heat slug | Chun-Chi Lee | 2005-09-20 |
| 6939790 | Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder | Jau-Shoung Chen | 2005-09-06 |
| 6933605 | Semiconductor package | Chi-Tsung Chiu, Sung-Mao Wu | 2005-08-23 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-08-09 |
| 6908842 | Bumping process | Jau-Shoung Chen | 2005-06-21 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Jeng-Da Wu, Chih-Huang Chang +1 more | 2005-05-10 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-04-12 |
| 6864168 | Bump and fabricating process thereof | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Chih-Huang Chang, Jeng-Da Wu +2 more | 2005-03-08 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-01-25 |
| 6838762 | Water-level package with bump ring | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2005-01-04 |