Issued Patents 2005
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972583 | Method for testing electrical characteristics of bumps | — | 2005-12-06 |
| 6967153 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-11-22 |
| 6933616 | Multi-chip module packaging device using flip-chip bonding technology | — | 2005-08-23 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-08-09 |
| 6924557 | Semiconductor package | — | 2005-08-02 |
| 6916732 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Yung-I Yeh | 2005-07-12 |
| 6878963 | Device for testing electrical characteristics of chips | — | 2005-04-12 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-04-12 |
| 6875683 | Method of forming bump | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2005-04-05 |
| 6861346 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2005-03-01 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-01-25 |
| 6838311 | Flip chip package and method for forming the same | — | 2005-01-04 |