Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960822 | Solder mask and structure of a substrate | Yi Ding | 2005-11-01 |
| 6916732 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Jen-Kuang Fang | 2005-07-12 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960822 | Solder mask and structure of a substrate | Yi Ding | 2005-11-01 |
| 6916732 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Jen-Kuang Fang | 2005-07-12 |