Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6891274 | Under-bump-metallurgy layer for improving adhesion | Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more | 2005-05-10 |
| 6863936 | Method of forming selective electroless plating on polymer surfaces | Peter Malcolm Moran, Harvey Phillips | 2005-03-08 |
| 6864168 | Bump and fabricating process thereof | Ho-Ming Tong, Chun-Chi Lee, Su Tao, Chih-Huang Chang, Jeng-Da Wu +2 more | 2005-03-08 |
| 6838806 | Vibratory in-plane tunneling gyroscope | Bee Lee Chua, Holden King Ho Li, Yuan Xu, Francis Eng Hock Tay | 2005-01-04 |