Issued Patents 2004
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833613 | Stacked semiconductor package having laser machined contacts | Salman Akram, Alan G. Wood | 2004-12-21 |
| 6833727 | Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Malcolm Grief, Gurtej S. Sandhu | 2004-12-21 |
| 6833627 | Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography | — | 2004-12-21 |
| 6831475 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2004-12-14 |
| 6828812 | Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections | Alan G. Wood, Trung T. Doan, David R. Hembree | 2004-12-07 |
| 6828173 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2004-12-07 |
| 6825547 | Semiconductor device including edge bond pads | Larry D. Kinsman, Walter L. Moden | 2004-11-30 |
| 6819003 | Recessed encapsulated microelectronic devices and methods for formation | — | 2004-11-16 |
| 6814778 | Method for continuous mode solder jet apparatus | — | 2004-11-09 |
| 6815327 | Mask repattern process | — | 2004-11-09 |
| 6815314 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 2004-11-09 |
| 6815968 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2004-11-09 |
| 6808947 | Substrate mapping | Derek Gochnour | 2004-10-26 |
| 6803656 | Semiconductor device including combed bond pad opening | Walter L. Moden, Larry D. Kinsman | 2004-10-12 |
| 6803303 | Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts | William M. Hiatt, Charles M. Watkins, Nishant Sinha | 2004-10-12 |
| 6800505 | Semiconductor device including edge bond pads and related methods | Larry D. Kinsman, Walter L. Moden | 2004-10-05 |
| 6801048 | Device and method for testing integrated circuit dice in an integrated circuit module | James M. Wark, Eric S. Nelson, Kevin G. Duesman | 2004-10-05 |
| 6797545 | Method and apparatus for fabricating electronic device | Kevin G. Duesman, Alan G. Wood | 2004-09-28 |
| 6798224 | Method for testing semiconductor wafers | David R. Hembree, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2004-09-28 |
| 6794699 | Annular gate and technique for fabricating an annular gate | Lucien J. Bissey, Kevin G. Duesman | 2004-09-21 |
| 6791185 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2004-09-14 |
| 6791164 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2004-09-14 |
| 6787394 | Methods of wafer level fabrication and assembly of chip scale packages | — | 2004-09-07 |
| 6787396 | Method of manufacturing LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2004-09-07 |
| 6784544 | Semiconductor component having conductors with wire bondable metalization layers | — | 2004-08-31 |