Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830500 | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Dinesh Chopra | 2004-12-14 |
| 6803303 | Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts | William M. Hiatt, Warren M. Farnworth, Charles M. Watkins | 2004-10-12 |
| 6787450 | High aspect ratio fill method and resulting structure | Paul A. Morgan | 2004-09-07 |
| 6757971 | Filling plugs through chemical mechanical polish | — | 2004-07-06 |
| 6759751 | Constructions comprising solder bumps | — | 2004-07-06 |
| 6756682 | High aspect ratio fill method and resulting structure | Paul A. Morgan | 2004-06-29 |
| 6710442 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, William M. Hiatt | 2004-03-23 |
| 6706632 | Methods for forming capacitor structures; and methods for removal of organic materials | — | 2004-03-16 |
| 6703272 | Methods of forming spaced conductive regions, and methods of forming capacitor constructions | Theodore M. Taylor | 2004-03-09 |