Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803303 | Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts | Warren M. Farnworth, Charles M. Watkins, Nishant Sinha | 2004-10-12 |
| 6710442 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, Nishant Sinha | 2004-03-23 |
| 6673649 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages | Warren M. Farnworth | 2004-01-06 |