Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825564 | Nickel bonding cap over copper metalized bondpads | Jeffery N. Gleason | 2004-11-30 |
| 6767817 | Asymmetric plating | Warren M. Farnworth | 2004-07-27 |
| 6710442 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Warren M. Farnworth, William M. Hiatt, Nishant Sinha | 2004-03-23 |