Issued Patents 2004
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830500 | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods | Nishant Sinha | 2004-12-14 |
| 6759330 | Method of providing a structure using self-aligned features | Kevin G. Donohoe, Cem Basceri | 2004-07-06 |
| 6756678 | Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby | Fred Fishburn | 2004-06-29 |
| 6756301 | Method of forming a metal seed layer for subsequent plating | Terry L. Gilton | 2004-06-29 |
| 6746316 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2004-06-08 |
| 6736869 | Method for forming a planarizing pad for planarization of microelectronic substrates | Vishnu K. Agarwal | 2004-05-18 |
| 6736926 | Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning | Scott Meikle | 2004-05-18 |
| 6730609 | Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device | Bradley J. Howard | 2004-05-04 |
| 6727175 | Method of controlling metal formation processes using ion implantation, and system for performing same | — | 2004-04-27 |
| 6720265 | Composition compatible with aluminum planarization and methods therefore | — | 2004-04-13 |
| 6716090 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2004-04-06 |
| 6712676 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2004-03-30 |
| 6706139 | Method and apparatus for cleaning a web-based chemical mechanical planarization system | Scott E. Moore | 2004-03-16 |
| 6703309 | Method of reducing oxidation of metal structures using ion implantation, and device formed by such method | — | 2004-03-09 |
| 6676484 | COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHING WITH A FIXED ABRASIVE PAD | — | 2004-01-13 |
| 6672949 | Polishing apparatus | Scott E. Moore | 2004-01-06 |
| 6672946 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads | Scott Meikle | 2004-01-06 |