Issued Patents 2004
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833613 | Stacked semiconductor package having laser machined contacts | Salman Akram, Warren M. Farnworth | 2004-12-21 |
| 6828812 | Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections | Warren M. Farnworth, Trung T. Doan, David R. Hembree | 2004-12-07 |
| 6828175 | Semiconductor component with backside contacts and method of fabrication | Trung T. Doan | 2004-12-07 |
| 6815314 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 2004-11-09 |
| 6798224 | Method for testing semiconductor wafers | David R. Hembree, Warren M. Farnworth, Salman Akram, C. Patrick Doherty, Andrew J. Krivy | 2004-09-28 |
| 6797545 | Method and apparatus for fabricating electronic device | Warren M. Farnworth, Kevin G. Duesman | 2004-09-28 |
| 6791185 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2004-09-14 |
| 6773938 | Probe card, e.g., for testing microelectronic components, and methods for making same | Trung T. Doan, David R. Hembree | 2004-08-10 |
| 6773957 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Warren M. Farnworth | 2004-08-10 |
| 6763578 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 2004-07-20 |
| 6756253 | Method for fabricating a semiconductor component with external contact polymer support layer | Warren M. Farnworth | 2004-06-29 |
| 6740960 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Warren M. Farnworth, Mike Brooks | 2004-05-25 |
| 6737882 | Method for universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2004-05-18 |
| 6730999 | Clip chip carrier | Warren M. Farnworth, Derek Gochnour | 2004-05-04 |
| 6715018 | Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer | Warren M. Farnworth | 2004-03-30 |
| 6710284 | Laser marking techniques for bare semiconductor die | Warren M. Farnworth | 2004-03-23 |
| 6705513 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Warren M. Farnworth | 2004-03-16 |
| 6680213 | Method and system for fabricating contacts on semiconductor components | Warren M. Farnworth, Douglas Kelly | 2004-01-20 |