Issued Patents 2004
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828812 | Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections | Warren M. Farnworth, Alan G. Wood, Trung T. Doan | 2004-12-07 |
| 6819127 | Method for testing semiconductor components using interposer | — | 2004-11-16 |
| 6806567 | Chip on board with heat sink attachment and assembly | — | 2004-10-19 |
| 6806493 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | Salman Akram, Derek Gochnour | 2004-10-19 |
| 6798224 | Method for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2004-09-28 |
| 6784113 | Chip on board and heat sink attachment methods | — | 2004-08-31 |
| 6773938 | Probe card, e.g., for testing microelectronic components, and methods for making same | Alan G. Wood, Trung T. Doan | 2004-08-10 |
| 6774651 | Method for aligning and connecting semiconductor components to substrates | — | 2004-08-10 |
| 6744346 | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece | Salman Akram | 2004-06-01 |
| 6735855 | Methods for electrical connector | Salman Akram, Warren M. Farnworth | 2004-05-18 |
| 6730526 | Multi-chip module system and method of fabrication | Salman Akram, James M. Wark | 2004-05-04 |
| 6725536 | Methods for the fabrication of electrical connectors | Salman Akram, Warren M. Farnworth | 2004-04-27 |
| 6720652 | Apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, James M. Wark | 2004-04-13 |
| 6710612 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2004-03-23 |
| 6709878 | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece | Salman Akram | 2004-03-23 |
| 6703640 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | Salman Akram, Derek Gochnour | 2004-03-09 |
| 6696669 | Circuit and method for heating an adhesive to package or rework a semiconductor die | Salman Akram | 2004-02-24 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2004-02-17 |
| 6687990 | Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby | Salman Akram, Derek Gochnour, Michael E. Hess | 2004-02-10 |
| 6687989 | Method for fabricating interconnect having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, James M. Wark, John O. Jacobson, Salman Akram | 2004-02-10 |