Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830719 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2004-12-14 |
| 6808947 | Substrate mapping | Warren M. Farnworth | 2004-10-26 |
| 6806493 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | David R. Hembree, Salman Akram | 2004-10-19 |
| 6764549 | Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2004-07-20 |
| 6730999 | Clip chip carrier | Warren M. Farnworth, Alan G. Wood | 2004-05-04 |
| 6710612 | CSP BGA test socket with insert and method | Warren M. Farnworth, David R. Hembree | 2004-03-23 |
| 6703640 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | David R. Hembree, Salman Akram | 2004-03-09 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2004-02-17 |
| 6687990 | Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby | Salman Akram, Michael E. Hess, David R. Hembree | 2004-02-10 |