Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830719 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2004-12-14 |
| 6815261 | Encapsulation method in a molding machine for an electronic device | — | 2004-11-09 |
| 6777965 | Interposer for electrically coupling a semiconductive device to an electrical apparatus | — | 2004-08-17 |
| 6764549 | Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2004-07-20 |
| 6760224 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2004-07-06 |
| 6690188 | Method of testing a semiconductor device | — | 2004-02-10 |