Issued Patents 2004
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836003 | Integrated circuit package alignment feature | Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2004-12-28 |
| 6835604 | Methods for transverse hybrid LOC package | — | 2004-12-28 |
| 6830961 | Methods for leads under chip in conventional IC package | — | 2004-12-14 |
| 6815807 | Method of fabricating a redundant pinout configuration for signal enhancement in an IC package | — | 2004-11-09 |
| 6778404 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2004-08-17 |
| 6777790 | Redundant pinout configuration for signal enhancement in IC packages | — | 2004-08-17 |
| 6772510 | Mapable tape apply for LOC and BOC packages | — | 2004-08-10 |
| 6765291 | IC package with dual heat spreaders | — | 2004-07-20 |
| 6760970 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2004-07-13 |
| 6760224 | Heat sink with alignment and retaining features | Walter L. Moden, Larry D. Kinsman, Leonard E. Mess | 2004-07-06 |
| 6758696 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2004-07-06 |
| 6756659 | Die paddle clamping method for wire bond enhancement | — | 2004-06-29 |
| 6753598 | Transverse hybrid LOC package | — | 2004-06-22 |
| 6753482 | Semiconductor component with adjustment circuitry | Aaron Schoenfeld, Tyler Gomm | 2004-06-22 |
| 6751859 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2004-06-22 |
| 6747344 | Lead frame assemblies with voltage reference plane and IC packages including same | Jerry M. Brooks, Terry R. Lee | 2004-06-08 |
| 6743658 | Methods of packaging an integrated circuit | — | 2004-06-01 |
| 6740546 | Packaged microelectronic devices and methods for assembling microelectronic devices | Mike Brooks | 2004-05-25 |
| 6738263 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2004-05-18 |
| 6717257 | Lead frame decoupling capacitor, semiconductor device packages including the same and methods | Chris G. Martin | 2004-04-06 |