Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836003 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Leland R. Nevill, Jerrold L. King | 2004-12-28 |
| 6825685 | Method and system for wafer level testing and burning-in semiconductor components | — | 2004-11-30 |
| 6756802 | Test system for electronic modules having contactors with spring segment terminal portions | — | 2004-06-29 |
| 6741091 | Test method for electronic modules using contractors and conductive polymer contacts | — | 2004-05-25 |
| 6727715 | Test system and test contactor for electronic modules having beam spring contacts | — | 2004-04-27 |