Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836003 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2004-12-28 |
| 6787399 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2004-09-07 |
| 6781848 | Single-piece molded module housing | Warren M. Farnworth | 2004-08-24 |
| 6773955 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2004-08-10 |
| 6762485 | Plastic lead frames for semiconductor devices | Tongbi Jiang | 2004-07-13 |
| 6740545 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 2004-05-25 |
| 6724073 | Plastic lead frames for semiconductor devices and packages including same | Tongbi Jiang | 2004-04-20 |
| 6686655 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2004-02-03 |
| 6682946 | Method of using a semiconductor chip package | Leland R. Nevill | 2004-01-27 |
| 6677671 | Apparatus for forming a stack of packaged memory dice | Jerry M. Brooks | 2004-01-13 |