Issued Patents 2004
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833510 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2004-12-21 |
| 6825570 | Resistance-reducing conductive adhesives for attachment of electronic components | Whonchee Lee | 2004-11-30 |
| 6825569 | BGA package having substrate with patterned solder mask defining open die attach area | Edward A. Schrock | 2004-11-30 |
| 6820502 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2004-11-23 |
| 6818460 | Method for applying adhesives to a lead frame | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2004-11-16 |
| 6812064 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Mike Connell, Li Li, Curtis Hollingshead | 2004-11-02 |
| 6803657 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2004-10-12 |
| 6791168 | Semiconductor package with circuit side polymer layer and wafer level fabrication method | Mike Connell | 2004-09-14 |
| 6788552 | Method and apparatus for reducing substrate bias voltage drop | Zhiqiang Wu | 2004-09-07 |
| 6787399 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Jerrold L. King | 2004-09-07 |
| 6784024 | Die attach curing method for semiconductor device | — | 2004-08-31 |
| 6779258 | Semiconductor packages and methods for making the same | Casey Prindiville, Bret K. Street | 2004-08-24 |
| 6777268 | Method of fabricating tape attachment chip-on-board assemblies | — | 2004-08-17 |
| 6774480 | Method and structure for manufacturing improved yield semiconductor packaged devices | — | 2004-08-10 |
| 6770164 | Method for attaching a semiconductor die to a substrate | Edward A. Schrock | 2004-08-03 |
| 6770981 | Composite interposer for BGA packages | Edward A. Schrock | 2004-08-03 |
| 6768209 | UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES | Curtis Hollingshead, Warren M. Farnworth | 2004-07-27 |
| 6765652 | Forming thermally curable materials on a support structure in an electronic device | — | 2004-07-20 |
| 6762485 | Plastic lead frames for semiconductor devices | Jerrold L. King | 2004-07-13 |
| 6757176 | Circuit board | Yong Du | 2004-06-29 |
| 6750070 | Process for manufacturing flip-chip semiconductor assembly | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2004-06-15 |
| 6740821 | Selectively configurable circuit board | David Y. Kao | 2004-05-25 |
| 6737299 | Thermally conductive adhesive tape for semiconductor devices and method for using the same | — | 2004-05-18 |
| 6724073 | Plastic lead frames for semiconductor devices and packages including same | Jerrold L. King | 2004-04-20 |
| 6717259 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | W. Jeff Reeder | 2004-04-06 |