Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6798057 | Thin stacked ball-grid array package | Todd O. Bolkin | 2004-09-28 |
| 6793749 | Automated method of attaching flip-chip devices to a substrate | Rich Fogal, John VanNortwick | 2004-09-21 |
| 6777071 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2004-08-17 |
| 6778404 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2004-08-17 |
| 6773523 | Automated method of attaching flip chip devices to a substrate | Rich Fogal, John VanNortwick | 2004-08-10 |
| 6750070 | Process for manufacturing flip-chip semiconductor assembly | John VanNortwick, Bret K. Street, Tongbi Jiang | 2004-06-15 |
| 6709896 | Methods for use in packaging applications using an adhesive composition | Tongbi Jiang, Edward A. Schrock | 2004-03-23 |
| 6699928 | Adhesive composition for use in packaging applications | Tongbi Jiang, Edward A. Schrock | 2004-03-02 |
| 6689635 | Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes | Tongbi Jiang | 2004-02-10 |
| 6682955 | Stacked die module and techniques for forming a stacked die module | Timothy L. Jackson | 2004-01-27 |