Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825569 | BGA package having substrate with patterned solder mask defining open die attach area | Tongbi Jiang | 2004-11-30 |
| 6770981 | Composite interposer for BGA packages | Tongbi Jiang | 2004-08-03 |
| 6770164 | Method for attaching a semiconductor die to a substrate | Tongbi Jiang | 2004-08-03 |
| 6710456 | Composite interposer for BGA packages | Tongbi Jiang | 2004-03-23 |
| 6709896 | Methods for use in packaging applications using an adhesive composition | Chad A. Cobbley, Tongbi Jiang | 2004-03-23 |
| 6707152 | Semiconductor device, electrical conductor system, and method of making | — | 2004-03-16 |
| 6699928 | Adhesive composition for use in packaging applications | Chad A. Cobbley, Tongbi Jiang | 2004-03-02 |