Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835592 | Methods for molding a semiconductor die package with enhanced thermal conductivity | Frank Hall | 2004-12-28 |
| 6778404 | Stackable ball grid array | Cary J. Baerlocher, Chad A. Cobbley, David J. Corisis | 2004-08-17 |
| 6764882 | Two-stage transfer molding method to encapsulate MMC module | — | 2004-07-20 |
| 6746895 | Method for encapsulating a multi-chip substrate array | David L. Peters | 2004-06-08 |
| 6747345 | Exposed die molding apparatus | — | 2004-06-08 |
| 6734571 | Semiconductor assembly encapsulation mold | — | 2004-05-11 |
| 6730995 | Two-stage transfer molding device to encapsulate MMC module | — | 2004-05-04 |
| 6683388 | Method and apparatus for packaging a microelectronic die | — | 2004-01-27 |
| 6677675 | Microelectronic devices and microelectronic die packages | — | 2004-01-13 |