Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800930 | Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies | Tim Murphy | 2004-10-05 |
| 6682955 | Stacked die module and techniques for forming a stacked die module | Chad A. Cobbley | 2004-01-27 |