Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831301 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2004-12-14 |
| 6800930 | Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies | Timothy L. Jackson | 2004-10-05 |