Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812064 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Tongbi Jiang, Mike Connell, Li Li | 2004-11-02 |
| 6768209 | UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES | Tongbi Jiang, Warren M. Farnworth | 2004-07-27 |