Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812064 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Tongbi Jiang, Li Li, Curtis Hollingshead | 2004-11-02 |
| 6791168 | Semiconductor package with circuit side polymer layer and wafer level fabrication method | Tongbi Jiang | 2004-09-14 |