Issued Patents 2004
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6710456 | Composite interposer for BGA packages | Edward A. Schrock | 2004-03-23 |
| 6710462 | Method of pressure curing for reducing voids in a die attach bondline and applications thereof | — | 2004-03-23 |
| 6709896 | Methods for use in packaging applications using an adhesive composition | Chad A. Cobbley, Edward A. Schrock | 2004-03-23 |
| 6707147 | Substrates and assemblies including pre-applied adhesion promoter | Brenton L. Dickey | 2004-03-16 |
| 6706559 | Method of attaching a leadframe to singulated semiconductor dice | Syed Sajid Ahmad, Walter L. Moden | 2004-03-16 |
| 6700183 | Low temperature die attaching material for BOC packages and products comprising such material | — | 2004-03-02 |
| 6699928 | Adhesive composition for use in packaging applications | Chad A. Cobbley, Edward A. Schrock | 2004-03-02 |
| 6691406 | Methods of die attachment for BOC and F/C surface mount | Casey L. Prindivill | 2004-02-17 |
| 6689635 | Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes | Chad A. Cobbley | 2004-02-10 |
| 6685083 | Ultrasonic vibration mode for wire bonding | Zhiqiang Wu | 2004-02-03 |
| 6684717 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2004-02-03 |