Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818460 | Method for applying adhesives to a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2004-11-16 |
| 6803657 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2004-10-12 |
| 6796028 | Method of Interconnecting substrates for electrical coupling of microelectronic components | — | 2004-09-28 |
| 6706559 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2004-03-16 |
| 6703260 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes | — | 2004-03-09 |