Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740545 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 2004-05-25 |
| 6699734 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, Larry D. Kinsman, Timothy J. Allen | 2004-03-02 |