Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831353 | Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die | Aaron Schoenfeld | 2004-12-14 |
| 6815251 | High density modularity for IC's | Salman Akram | 2004-11-09 |
| 6781839 | Vertical surface mount apparatus with thermal carrier and method | Larry D. Kinsman, Walter L. Moden | 2004-08-24 |
| 6773955 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2004-08-10 |
| 6747344 | Lead frame assemblies with voltage reference plane and IC packages including same | David J. Corisis, Terry R. Lee | 2004-06-08 |
| 6740971 | Cavity ball grid array apparatus having improved inductance characteristics | Steven G. Thummel | 2004-05-25 |
| 6738263 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2004-05-18 |
| 6737734 | Structure and method for securing bussing leads | Larry D. Kinsman, Timothy J. Allen | 2004-05-18 |
| 6686655 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2004-02-03 |
| 6677671 | Apparatus for forming a stack of packaged memory dice | Jerrold L. King | 2004-01-13 |