Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815817 | Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip | Salman Akram | 2004-11-09 |
| 6801048 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2004-10-05 |
| 6782613 | Method of making an interposer with contact structures | Salman Akram | 2004-08-31 |
| 6730526 | Multi-chip module system and method of fabrication | Salman Akram, David R. Hembree | 2004-05-04 |
| 6720652 | Apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, David R. Hembree | 2004-04-13 |
| 6710614 | Methods for using an interposer/converter to allow single-sided contact to circuit modules | — | 2004-03-23 |
| 6687989 | Method for fabricating interconnect having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, John O. Jacobson, Salman Akram | 2004-02-10 |