Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821867 | Method for forming grooves in the scribe region to prevent a warp of a semiconductor substrate | Nobuyoshi Matsuura, Yasuhiko Kouno, Masaharu Kubo | 2004-11-23 |
| 6803294 | Semiconductor wafer and manufacturing method of semiconductor device | Yasuhiko Kouno, Nobuyoshi Matsuura, Masaharu Kubo | 2004-10-12 |
| 6784533 | Semiconductor device | Hiroya Shimizu, Asao Nishimura, Tosiho Miyamoto, Hideki Tanaka | 2004-08-31 |
| 6784549 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Tomio Iwasaki, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara, Masashi Sahara | 2004-08-31 |
| 6777816 | Multi-chip module | Atsushi Kazama, Akihiro Yaguchi, Asao Nishimura | 2004-08-17 |
| 6714030 | Semiconductor inspection apparatus | Ryuji Kohno, Yoshishige Endo, Masatoshi Kanamaru, Atsushi Hosogane, Hideyuki Aoki +1 more | 2004-03-30 |
| 6696765 | Multi-chip module | Atsushi Kazama, Akihiro Yaguchi, Asao Nishimura | 2004-02-24 |
| 6692686 | Blow molding method and apparatus | Toshiaki Gonda, Hiroshi Noma, Takashi Miyazaki | 2004-02-17 |
| 6686274 | Semiconductor device having cobalt silicide film in which diffusion of cobalt atoms is inhibited and its production process | Hiromi Shimazu, Tomio Iwasaki, Hiroyuki Ohta, Shuji Ikeda | 2004-02-03 |