Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784549 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Tomio Iwasaki, Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara | 2004-08-31 |
| 6780757 | Semiconductor integrated circuit device and method for making the same | Masayuki Suzuki, Shinji Nishihara, Shinichi Ishida, Hiromi Abe, Sonoko Tohda +3 more | 2004-08-24 |