Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784549 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Tomio Iwasaki, Hideo Miura, Hiroyuki Ohta, Shinji Nishihara, Masashi Sahara | 2004-08-31 |