Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784549 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara, Masashi Sahara | 2004-08-31 |
| 6781172 | Semiconductor device with adhesion-improvement capacitor and process for producing the device | Hiroshi Moriya, Hiroyuki Ohta, Shinpei Iijima, Isamu Asano, Yuzuru Ohji +1 more | 2004-08-24 |
| 6686274 | Semiconductor device having cobalt silicide film in which diffusion of cobalt atoms is inhibited and its production process | Hiromi Shimazu, Hiroyuki Ohta, Hideo Miura, Shuji Ikeda | 2004-02-03 |