Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6759271 | Flip chip type semiconductor device and method of manufacturing the same | — | 2004-07-06 |
| 6730248 | Foamed article of thermoplastic resin composition and process for producing it | Hideo Akimoto, Mitsuru Watari, Tatsuji Kawamura | 2004-05-04 |
| 6720650 | Semiconductor device having heat spreader attached thereto and method of manufacturing the same | — | 2004-04-13 |
| 6692686 | Blow molding method and apparatus | Toshiaki Gonda, Hideo Miura, Hiroshi Noma | 2004-02-17 |