Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821867 | Method for forming grooves in the scribe region to prevent a warp of a semiconductor substrate | Nobuyoshi Matsuura, Hideo Miura, Masaharu Kubo | 2004-11-23 |
| 6803294 | Semiconductor wafer and manufacturing method of semiconductor device | Hideo Miura, Nobuyoshi Matsuura, Masaharu Kubo | 2004-10-12 |