Issued Patents 2004
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831294 | Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes | Syouji Syukuri, Gorou Kitsukawa, Toshio Miyamoto | 2004-12-14 |
| 6822317 | Semiconductor apparatus including insulating layer having a protrusive portion | Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more | 2004-11-23 |
| 6798072 | Flip chip assembly structure for semiconductor device and method of assembling therefor | Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Masayoshi Shinoda | 2004-09-28 |
| 6784533 | Semiconductor device | Hiroya Shimizu, Tosiho Miyamoto, Hideki Tanaka, Hideo Miura | 2004-08-31 |
| 6784541 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh +3 more | 2004-08-31 |
| 6784554 | Semiconductor device and manufacturing method thereof | Ryoichi Kajiwara, Masahiro Koizumi, Masayoshi Shinoda, Akihiko Narisawa, Toshiaki Morita +2 more | 2004-08-31 |
| 6777816 | Multi-chip module | Atsushi Kazama, Akihiro Yaguchi, Hideo Miura | 2004-08-17 |
| 6770547 | Method for producing a semiconductor device | Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more | 2004-08-03 |
| 6720208 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 2004-04-13 |
| 6720591 | Semiconductor integrated circuit device | Toshio Miyamoto, Ichiro Anjo, Yoshihide Yamaguchi | 2004-04-13 |
| 6710446 | Semiconductor device comprising stress relaxation layers and method for manufacturing the same | Akira Nagai, Takumi Ueno, Haruo Akahoshi, Syuji Eguchi, Masahiko Ogino +2 more | 2004-03-23 |
| 6696765 | Multi-chip module | Atsushi Kazama, Akihiro Yaguchi, Hideo Miura | 2004-02-24 |