Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831294 | Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes | Asao Nishimura, Gorou Kitsukawa, Toshio Miyamoto | 2004-12-14 |