Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6764878 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2004-07-20 |
| 6759279 | Method of manufacturing semiconductor device having resin sealing body | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta | 2004-07-06 |
| 6723583 | Method of manufacturing a semiconductor device using a mold | Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume +4 more | 2004-04-20 |
| 6720208 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2004-04-13 |