Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6764878 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani | 2004-07-20 |
| 6759279 | Method of manufacturing semiconductor device having resin sealing body | Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Masahiro Ichitani | 2004-07-06 |