Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831009 | Wiring substrate and an electroless copper plating solution for providing interlayer connections | Takeyuki Itabashi, Eiji Takai, Naoki Nishimura, Tadashi Iida, Yoshinori Ueda | 2004-12-14 |
| 6815357 | Process and apparatus for manufacturing a semiconductor device | Yoshio Homma, Noriyuki Sakuma, Hiroshi Nakano, Takeyuki Itabashi | 2004-11-09 |
| 6805915 | Electroless copper plating solution, electroless copper plating process and production process of circuit board | Takeyuki Itabashi, Hiroshi Kanemoto, Eiji Takai, Naoki Nishimura, Tadashi Iida +1 more | 2004-10-19 |
| 6784541 | Semiconductor module and mounting method for same | Shuji Eguchi, Akira Nagai, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2004-08-31 |
| 6710446 | Semiconductor device comprising stress relaxation layers and method for manufacturing the same | Akira Nagai, Takumi Ueno, Syuji Eguchi, Masahiko Ogino, Toshiya Satoh +2 more | 2004-03-23 |
| 6680540 | Semiconductor device having cobalt alloy film with boron | Hiroshi Nakano, Takeyuki Itabashi | 2004-01-20 |