Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831009 | Wiring substrate and an electroless copper plating solution for providing interlayer connections | Takeyuki Itabashi, Haruo Akahoshi, Naoki Nishimura, Tadashi Iida, Yoshinori Ueda | 2004-12-14 |
| 6805915 | Electroless copper plating solution, electroless copper plating process and production process of circuit board | Takeyuki Itabashi, Hiroshi Kanemoto, Haruo Akahoshi, Naoki Nishimura, Tadashi Iida +1 more | 2004-10-19 |