Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822317 | Semiconductor apparatus including insulating layer having a protrusive portion | Kosuke Inoue, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-11-23 |
| 6791178 | Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices | Takao Terabayashi, Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda | 2004-09-14 |
| 6780748 | Method of fabricating a wafer level chip size package utilizing a maskless exposure | Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda | 2004-08-24 |
| 6770547 | Method for producing a semiconductor device | Kosuke Inoue, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-08-03 |
| 6756688 | Wiring board and its production method, semiconductor device and its production method, and electronic apparatus | Yasumori Narizuka, Mitsuko Itou, Hiroyuki Tenmei | 2004-06-29 |
| 6720591 | Semiconductor integrated circuit device | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura | 2004-04-13 |
| 6695200 | Method of producing electronic part with bumps and method of producing electronic part | Takamichi Suzuki, Noriyuki Oroku, Kosuke Inoue | 2004-02-24 |