Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822317 | Semiconductor apparatus including insulating layer having a protrusive portion | Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more | 2004-11-23 |
| 6791178 | Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices | Yoshihide Yamaguchi, Takao Terabayashi, Hiroyuki Tenmei, Hiroshi Hozoji | 2004-09-14 |
| 6780748 | Method of fabricating a wafer level chip size package utilizing a maskless exposure | Yoshihide Yamaguchi, Hiroyuki Tenmei, Hiroshi Hozoji | 2004-08-24 |
| 6770547 | Method for producing a semiconductor device | Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more | 2004-08-03 |